Photonic integrated circuit design and prototyping.
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MULTIPLE SOLUTIONS

All main integration platforms

FULL OPTICAL SYSTEM

into a single photonic chip

Services

 

Embedding a full optical system into a single photonic chip can be a complex and time-consuming task.

VLC Photonics, as a fabless design house, can help with multiple solutions spanning the whole optical integration process, from the initial concept evaluation to the circuit layout, prototyping and testing of the chip.

  • Photonic Integration Consultancy

    Backed through our years-long expertise on optical systems, VLC Photonics provides system-level engineering services to enable the exploration of photonic integration for a specific application or field. VLC Photonics can support you with the technical feasibility evaluation for integrating a given optical system, and to deliver an extensive performance modeling of the expected solution, along with then main technological choices and design building blocks available.

    Most importantly, VLC Photonics can support on the techno-economic evaluation, estimating the costs of every stage for prototyping and taking a photonic integrated circuit into production. Business considerations like intellectual property issues, cost escalation in production, or large volume transfers, can also be evaluated as part of these studies.


  • PIC Design

    Based on your technical requirements, we can design a photonic integrated circuit (PIC) that integrates your required functionalities on the target platform. As a fabless and independent design house, we are skilled on the main photonic material platforms: III-V semiconductors (InP and GaAs) and Silicon Photonics (thin and thick SOI, SiO2/PLC, Si3N4), combining multiple design frameworks and toolboxes and with our propietary modules and libraries of functional building blocks, guaranteeing always the optimal design-technology match.

     

    We comply with industry standard design techniques for manufacturability, testability and packaging. Moreover, your intellectual property will always be confidential and secured, and any IP developed through the integration process can be transfered to you on demand.


  • PIC Manufacturing

    VLC Photonics can manufacture any photonic circuit design for the main material platforms (InP, GaAs, SOI, SiO2/PLC, Si3N4/TripleX) through its foundry network, in what is known as fabless operation. In this way, VLC Photonics works closely with several foundries to always provide the best solution in terms of cost, timing and performance, but also reliability and yield.

     

    Prototype runs usually range from a single PIC to a few tens of PICs, and risk and cycle time are greatly minimized through our significant experience with all foundry partners. Additionally, cost can be greatly reduced through the use of pre-scheduled Multi-Project Wafer runs (similar to electronics’ shuttle runs), where fabrications costs can be shared among multiple users.

     

    Dedicated runs can scale the number of PICs to several tens or hundreds of dies, and also allow for more flexibility in terms of chip sizes, fabrication timing, or custom processings. VLC Photonics can also provide such service, including complete mask layout and process definitions and adaptations if required.

     

    Finally, VLC Photonics can support you when moving to production, where larger volumes are manufactured. Depending on the end market to be addressed, this can mean from thousands to millions of PICs, and VLC Photonics has the expertise to guide you through the hurdles of desing adaptations, foundry transfer and logistics.


  • PIC Characterization and Test

    After fabrication, chips from the corresponding foundry can be fully characterized at VLC Photonics’ facilities. Physical as well as functional characterization is performed on the bare dies to evaluate the design performance and the manufacturing process and tolerances. Our labs include digital and analog testing equipment up to 40 GHz and several multi-probe stations with vertical and lateral coupling setups enclosed in clean vaults.

     

    Eventually, if the PIC is also packaged, VLC Photonics can also provide device level testing of the electrical and optical characteristics and performance. This also includes thermal testing, and if required, environmental test and certification through external partners for specific applications (standard telecoms, space, harsh sensing, etc.).


  • PIC Packaging

    Additionally, if required, PIC can also be assembled, packaged and connectorized electrically and optically through our external network of partners. As an independent solution provider, VLC Photonics works with many packaging companies, each of them providing different services and having different capabilities. The range of options include standard and custom packages, DC and RF connections, thermal control, external electronics (TIAs, drivers, etc.) or the use of fiber arrays and specialty fibers.


  • Foundry Process Design Kits

    VLC Photonics can work side by side with foundries to develop a photonic Process Design Kit (PDK). This PDK can provide photonic designers with a standard and lower-risk design environment, customized for the foundry-specific data, models and processes. This way, the foundry eases the access to its infrastructure, attracting more users and increasing their productivity and yield, while faster amortizing and profiting its investment in equipment and technology.

     

    Such PDK can provide access to component-level design and simulations, circuit layouts and DRC/verification tools together with accurate photonic device models in a unified software framework and workflow. The design kit libraries usually contain customizable, easily expandable building blocks for schematic capture, simulation, physical layout, and verification. These allow anyone to easily create a complete PIC design tailored to the foundry process technology, covering both the front and back-end of the development.


  • Multi-Project Wafer Prototyping Services

    Several foundries offer shared access fabrication services, known as Multi-Project Wafer (MPW) with generic integration technologies. Generic integration technologies allow for very distinct applications to be implemented in the same platform. After several years of operations and participation in all the MPW runs from all the platforms in the globe, VLC Photonics offers Standard Design Packages independent of the functional application of your request, following the flavor of the generic manufacturing technologies, but at the design level.

    Furthermore you can configure your MPW integration project on-line! Check our MPW services page and get immediate feedback!

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