Photonic integrated circuit design and prototyping. - Customers Private Area »
Feel free to call us: +34 96 133 78 84

Photonic Packaging Technical Report


Estimated release mid 2019

Contact us for more information

This document provides an extensive assessment of over 30 photonic packaging companies around the world and its capabilities. The purpose of this report is to ease the development of your photonic integrated modules, either R&D prototypes, pilot production or large-volumes, covering industry standard solutions or custom approaches (high-speed and dense interconnects, ruggedized assemblies, etc.). Save time and money purchasing this report and identify precisely which packager is best suited to fulfil your technical requirements.