Photonic integrated circuit design and prototyping.
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Photonic Packaging Technical Report

Estimated release April 2018

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This document provides an extensive assessment of over 30 photonic packaging companies around the world and its capabilities. The purpose of this report is to ease the development of your photonic integrated modules, either R&D prototypes, pilot production or large-volumes, covering industry standard solutions or custom approaches (high-speed and dense interconnects, ruggedized assemblies, etc.). Save time and money purchasing this report and identify precisely which packager is best suited to fulfil your technical requirements.

Currently under revision by our team of experts, this report will be available in March 2018. Don’t hesitate to download the abstract already available and please feel free to contact us now for more information regarding its content.