The European Photonics Industry Consortium is organizing a meeting on Photonic Integrated Circuit (PIC) testing, on the 16th and 17th February 2017 in Pisa, Italy.
Primary scope of the event is to discuss and list requirements, differentiating also where, how, and what has to be tested in the whole PICs manufacturing chain. At wafer level another important differentiation is given by the coupling methods.
Like packaging, testing starts at design level and ends with automated test machines. The discussion will range from probing techniques to handling and test procedures and also touch briefly on the needs and requirements for dedicated modular instrumentation.
Our characterization engineer Rocio Baños will be attending the event, and giving a presentation on “Challenges for PIC characterization” on Friday 17th at 12:20. You can check the progam and register in the following link: EPIC meeting on PIC testing 2017.