Introduction to PIC testing
Photonic integrated chip testing is next-level difficult from IC chip testing. The main reason for that is that it requires not only electrical probes to connect to the die but optical fiber probes as well. PIC testing can be done at wafer level or when the chip is already diced or cleaved. Testing optical, electrical DC and RF parameters is done by very carefully aligning probes with nanometer precision. Such characterization is a lengthy process, and depending on your project requirements, VLC Photonics can provide both manual and automated capabilities.
Testing packaged photonic integrated chips is a much easier task as there are already connectorized inputs and outputs defined by electrical pins and optical fiber pigtails. We also provide full characterization and testing services for packaged dies.
Our services also include in depth analysis of the measurement traces, failure mode analysis or root cause analysis, test reports for compliance with required specifications, and advice for probing and measurement optimization and design for testing.
The ways we can help your project
Our tests and characterizations are done in clean room laboratories by experienced engineers and best in class equipment. Our test processes are ISO 9001 certified.
Complete optical testing can be performed at signal frequencies up to 110 GHz frequency, using different types of light sources (lasers, supercontinuum, LEDs) at different wavelengths: from the visible to the near infra red.
Complete electrical testing – low and high electrical frequency testing, signal processing, multi probe testing stations.
If more extensive testing like environmental, radiation, mechanical (half sine, full wave vibration and shock tests) and temperature cycling or burn in are required, we have partners who can support too.
Industries and applications
No matter in which field or market are you working in, VLC Photonics will probably be able to help you. With experience in communications, signal processing, LIDAR, quantum, medical or instrumentation, chances are high that we have faced similar challenges in the past and we can help you with our experience.
Components and building blocks
Photonic testing can be done not only at circuit level but at component level too. Typical testings we can perform are listed (but not limited to) below:
- Passive waveguide devices: coupling and propagation losses (insertion / excess losses), cross-talk, polarization dependence, spectral response, etc.
- Photodetector responsivity, dark current, noise, etc.
- Modulator speed, extinction ratio, linearity, etc.
- Laser biasing, power, tuning range, linewidth, noise, etc.
