Photonic integrated circuit design and prototyping.

Photonic Packaging Technical Report

This document provides an extensive assessment of over 30 photonic packaging companies around the world and its capabilities. The purpose of this report is to ease the development of your photonic integrated modules, either R&D prototypes, pilot production or large-volumes, covering industry standard solutions or custom approaches (high-speed and dense interconnects, ruggedized assemblies, etc.). Save time and money purchasing this report and identify precisely which packager is best suited to fulfil your technical requirements.

Estimated release 2023

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