Introduction to PIC testing
Photonic integrated chip testing is next level difficult from IC chip testing. Main reason for that it requires not only needle electrodes to connect the chip but optical fibers as well. PIC testing can be done at wafer level, by probing with electrodes and small carefully aligned small fiber arrays or at chip level, when the die is already cut. Testing optical, Radio Frequency and electrical parameters of the PIC/chip and wafer is done by very carefully aligning probes with nanometer precision. Such characterization is lengthy process, but with latest automation achievements VLC Photonics provides both manual and automated services.
Testing completed photonic integrated chips are much easier task as there are already inputs and outputs defined by electrical pins and optical fibers. We provide full characterization and testing services for packed and unpacked chips and bare DIEs.
We provide PIC testing and characterization services for both, completely new designs exploring performance of the photonic integrated chip, which requires in depth analysis, failure mode analysis or root cause analysis; to providing test reports for compliance with specifications and customer requirements for well specified designs.
The ways we can help your project
Our tests and characterizations are done in high quality clean rooms by experienced engineers in close collaboration with University laboratories providing best in class equipment.
Complete optical testing at signal frequencies up to 50 GHz frequency including supercontinuum lasers and ultra-high optical resolution Brillion Optical Spectrum Analyzers.
Complete environmental mechanical and temperature testing – half sine, full wave vibration and shock tests, radiation tests and thermal cycling.
Complete electrical testing – low and high electrical frequency testing, signal processing, multi probe testing stations.
Industries and applications
No matter in which field and for what level testing certification is needed or just prototype device characterization, VLC Photonics will be able to help you. With extensive experience in communications, medical components or space missions designing, fabricating, and testing photonic integrated chips we will be able to help with most challenging designs and testing requirements.
Components and building blocks
Photonic integrated chips testing can be done not only at die/wafer level but at component level, couple of key components we can individually test on PIC are listed (but not limited) bellow:
- Passive waveguide devices: coupling and propagation losses (insertion / excess losses), cross-talk, polarization dependence, spectral response, etc.
- PD responsivity, dark current, noise, etc.
- Modulator speed, extinction ratio, etc.
- Laser biasing, power, tuning range, linewidth, noise, etc