In the line of testing, VLC offers basic capabilities to create prototyping assemblies. The idea of prototyping assembly is to have optical and electrical connections with PIC so that customer can perform the functional testing easily and quickly. VLC operates the assembly service in a ISO-6 (Class 1,000) clean room infrastructure

Service offerings:

  • Chip bonding into organic PCB or ceramic carriers for DC and RF operation
  • Fiber array pig-tailing
  • Electrical wire-bonding & flip-chip
  • Connectorization
  • Thermal management
We can offer in-house design services for the development of CoB assembly prototypes, low volume manufacturing.

Technical capabilities include:

  • Ad-hoc electrical low-signal board design (FR4 TG135, Roger4001, …)
  • Custom PCB for RF connectors
  • Assembly of electrical discrete components or integration of laser drivers (Under evaluation)
  • Special 3D modelling and PIC holder plate design
  • Optical mode shaping / coupling efficiency calculations
  • Light propagation modelling and reflections analysis
VLC Photonics has standardized a series of test assembly prototype solutions to enable more affordable PIC system testing to any market application. The main reason for this is to be able to satisfy end-users who are willing to perform system testing of their PICs, but do not have the infrastructure to be able to test a naked PIC. By providing standard assembly prototypes to end users to be able to test their devices, we believe and are convinced that we can contribute to:
  • Accelerate product development and adoption of PIC technologies.
  • Fill the gap for scale up between fabrication and packaging.
  • Close the loop from designed to measured devices.

PIC Development

PIC Development