In the line of testing, VLC offers basic capabilities to create prototyping assemblies.
The idea of prototyping assembly is to have optical and electrical connections with PIC so that customer can perform the functional testing easily and quickly.
VLC operates the assembly service in a ISO-6 (Class 1,000) clean room infrastructure
Service offerings:
- Chip bonding into organic PCB or ceramic carriers for DC and RF operation
- Fiber array pig-tailing
- Electrical wire-bonding & flip-chip
- Connectorization
- Thermal management
Technical capabilities include:
- Ad-hoc electrical low-signal board design (FR4 TG135, Roger4001, …)
- Custom PCB for RF connectors
- Assembly of electrical discrete components or integration of laser drivers (Under evaluation)
- Special 3D modelling and PIC holder plate design
- Optical mode shaping / coupling efficiency calculations
- Light propagation modelling and reflections analysis
- Accelerate product development and adoption of PIC technologies.
- Fill the gap for scale up between fabrication and packaging.
- Close the loop from designed to measured devices.
PIC Development
Consultancy
Design
Manufacturing
Wafer and Chip
Assembly
