As an independent solution provider, VLC Photonics works with many packaging companies, each of them providing different services and capabilities. The range of options includes:

– Eutectic or epoxy die bonding.

– Thermal control.

– DC and RF connections, RF routing design.

– Micro optic components (lenses, circulators, etc.).

– Wirebonding, ribbon bonding and flip-chip.

– PCB and ceramic subcarrier design and procurement.

– Alignment and bonding to standard single-mode fiber, fiber arrays, specialty fibers.

– Standard and custom housing, hermetic packages.

– External electronics (TIAs, drivers, etc.).

Test Assemblies

Additionally, if required, PICs can also be assembled, and connectorized electrically and optically in-house at VLC Photonics.