As an independent solution provider, VLC Photonics works with many packaging companies, each of them providing different services and capabilities. The range of options includes:

• -eutectic or epoxy die bonding,
• -thermal control,
• -DC and RF connections, RF routing design,
• -micro optic components (lenses, circulators, isolators, etc.),
• -wirebonding, ribbon bonding and flip-chip,
• -PCB and ceramic subcarrier design and procurement,
• – alignment and bonding to standard single-mode fiber, fiber arrays, specialty fibers,
• -standard and custom housing, hermetic packages,
• -external electronics (TIAs, drivers, etc.).

Test Assemblies

Additionally, if required, PICs can also be assembled, and connectorized electrically and optically in-house at VLC Photonics.