HomeBlogNewsEnsuring fidelity in PIC Testing:

Ensuring fidelity in PIC Testing:

Minimizing errors and optimizing results

Developing a first-time Photonic Integrated Circuit (PIC), whether as a building block, a component set, or a complete system, requires an exploratory iteration to validate and refine a new technology, often with uncertain outcomes. In this context, PIC testing plays a crucial role in identifying performance deviations, ensuring device functionality, and verifying fabrication consistency.

To ensure Known-Good-Dies (KGD) that meet performance expectations, it is essential to obtain trustworthy, high-precision data and establish a reliable correlation between theoretical models and experimental results. This is particularly important because untested and unvalidated devices often exhibit discrepancies between expected and actual performance due to fabrication tolerances, material variations, and environmental influences. Without a structured approach to PIC testing, unexpected trade-offs may arise, impacting the overall system’s performance and scalability.

This scenario makes Design for Testing (DFT) an essential strategy. A well-planned PIC testing methodology ensures that critical parameters are properly measured, debugging is efficient, and potential sources of variability are identified early in the development cycle. The ability to detect process-related variations and distinguish between device-intrinsic properties and setup artifacts is fundamental for advancing new photonic technologies and achieving stable, reproducible results.

The role of PIC Testing in device verification

The verification phase ensures that a PIC meets quality and performance requirements before advancing to larger-scale production or integration into a system. However, verification is not a straightforward process; it requires highly technical expertise and an awareness of uncontrollable factors, such as environmental conditions, instrument stability, and procedural consistency.

One of the key challenges in PIC testing is distinguishing between design-related issues and setup-induced artifacts. Unexpected measurement outcomes can often lead to incorrect assumptions about a device’s behavior. If a PIC does not meet expected performance metrics, the root cause could stem from instrument misalignment, setup drift, or external interferences, rather than an actual design flaw. Having a structured test strategy prevents unnecessary design modifications based on misleading data.

Measurement inconsistencies in PIC testing arise due to various factors. Instrument drift over time can impact repeatability, leading to deviations in measured values. Manual alignment tolerances and software-related scripting gaps can introduce measurement errors, affecting reliability. Additionally, environmental fluctuations such as humidity, temperature, and pressure can influence both the Device Under Test (DUT) and the testing instrumentation, making it critical to account for external conditions.

Without a carefully planned Design for Testing (DFT) approach, these factors can obscure actual device performance and slow down the development cycle.

Measurement errors and the need for calibration in PIC Testing

Measurement errors in PIC testing fall into two main categories: stochastic errors and systematic errors. Stochastic errors are random, caused by environmental variations, manual probe positioning, or fluctuations in instrument response time. These errors cannot be entirely eliminated, but they can be mitigated through averaging techniques, statistical analysis, and controlled measurement environments.

Systematic errors, on the other hand, arise from instrument miscalibration, mechanical instabilities, or software inaccuracies. These errors are predictable and correctable, provided that regular calibration routines are followed. Proper calibration of power meters, laser sources, and optical components ensures that measured values remain consistent over time. Cross-referencing measurements with pre-calibrated instruments or conducting reference tests on Known-Good-Dies (KGD) can further improve accuracy.

At VLC Photonics, we integrate calibration and synchronization verification steps into every PIC testing campaign, ensuring that measurement integrity is maintained. Our team conducts periodic equipment checks to verify that instrument calibration remains within manufacturer-specified tolerances, preventing systematic measurement drift. This proactive approach ensures that testing data reflects actual device performance rather than setup artifacts, allowing for precise debugging and optimization.

Design for Testing: A key factor in PIC Characterization

A Design for Testing (DFT) approach is essential in characterizing PIC performance across different fabrication runs. Beyond verifying an individual device, system-level characterization requires ensuring that all subsystems and functional blocks meet their specifications. Validating system functionality demands careful planning in test structure design, ensuring that measurement data can be collected efficiently and consistently.

To improve PIC testing reliability, it is essential to incorporate reference measurements of previously validated samples. This allows engineers to separate actual device variations from measurement artifacts and detect potential instrumental inconsistencies early in the process. By continuously monitoring performance variations over time, it becomes possible to fine-tune calibration parameters, improve measurement setups, and establish robust testing methodologies for future designs.

Managing Variability in PIC Testing Through Statistical Analysis

Hundreds of studies have highlighted the repeatability challenges of analog measurements, but one unavoidable truth remains: analog devices never produce identical results. Unlike digital electronics, where discrete values prevent small deviations from altering the final output, PICs naturally exhibit fluctuations in performance metrics such as bandwidth, polarization extinction ratio, signal-to-noise ratio, and insertion loss.

This variability, while inherent to analog systems, can be managed effectively through statistical modeling. By collecting large datasets, engineers can build reliable models that define expected performance distributions, enabling more precise Design for Testing (DFT) methodologies. Proper statistical analysis helps define acceptable tolerance limits, reducing unnecessary design iterations and improving the stability of PIC manufacturing processes.

At VLC Photonics, we emphasize a data-driven approach to PIC testing, combining statistical analysis with real-world experimental validation. By implementing calibration routines, debugging workflows, and structured testing methodologies, we ensure that measured results provide meaningful insights into device performance. Our expertise in PIC characterization and testing helps our clients navigate the complexities of first-time device development, reducing risks and accelerating the transition from design to real-world applications.

The role of a PIC Test House

The transition from theoretical PIC design to practical device fabrication is filled with challenges. Ensuring a smooth and predictable development cycle requires a well-defined PIC testing strategy, robust calibration techniques, and a Design for Testing (DFT) approach. These factors help reduce errors, improve measurement reliability, and provide meaningful insights into device behavior.

At VLC Photonics, our expertise in high-precision testing, debugging, and statistical analysis enables PIC developers to make data-driven decisions with confidence. By focusing on PIC testing best practices and Design for Testing (DFT) principles, we help our clients optimize their first-time devices, ensuring smooth integration into real-world applications.