When developing a new Photonic Integrated Circuit (PIC) prototype or iterating a previous optical circuit design, understanding the experimental performance of the manufactured PIC is crucial. PICs are small and fragile, making electrical and optical probing challenging and requiring special setups and equipment. To address these challenges, VLC Photonics introduced the photonics assembly commercial test board solutions in 2020, offering standard electrical and optical connectors to save costs and time, creating affordable testbeds and prototyping devices. VLC Photonics assembly test modules provide integration for characterization and fine-tuning of systems, facilitating the acceleration of product development and adoption of PIC technologies.
The beginning of VLC Photonics Assembly
VLC Photonics, having been acquired by the Hitachi High-Tech group, launched its first photonics assembly commercial test board solutions as an extension line to support complex photonic testing devices. This marked a significant milestone in the company’s journey, aligning with its mission to accelerate product development and adoption of PIC technologies. The initial photonics assembly offerings included Chip-on-Board (CoB) standard test assemblies, which provided a straightforward, cost-effective method to test PICs. These photonics assembly standard modules conformed to VLC’s processes being suitable for small quantities, and were designed to cater to various needs available in three configurations:
- -Electrical assembly: Suitable for optical coupling testing.
- -Optical assembly: Designed for fully optical applications.
- -Electro-Optical assembly: Combining both electrical and optical testing capabilities.
2011-2015: Origin, foundations, early developments and growth
Founded in July 2011 as a spin-off from the Polytechnic University of Valencia, VLC Photonics quickly established itself in the photonics industry. By 2015, the company had grown to a team of 21 members with extensive academic and industrial experience, laying a solid foundation for future innovations. During this period, the company used photonics assembly test board solutions to simplify electrical biasing.
Photonics Assembly Chip-on-Board test modules for multi-pad electrical biasing through PCB DC connectors adapted for fiber-array access in the optical setup as (left) butterfly shape, (middle) flip-chip, (right) rectangular shape.
2019: Establishment of Basic Photonics Assembly Capabilities
In 2019, VLC Photonics set up a lab equipped with basic photonics assembly tools for electrical and optical bonding, alongside internal training on calibration and utilizing this equipment. This began VLC’s journey towards providing comprehensive PIC prototyping solutions. Electro-optical test photonics assembly modules were introduced to demonstrate PIC functionalities in a laboratory environment, providing a handling module with mechanical protection.
Electro-Optical test photonics assembly modules enable a plug-in external interface to demonstrate PIC functionalities in a laboratory environment, either on an optical bench or in a lab probe station, providing a handling module with mechanical protection.
2020: Acquisition by Hitachi High-Tech and Expansion
In November 2020, VLC Photonics was acquired by Hitachi High-Tech, bringing additional resources and investment. This enabled VLC to upgrade its capabilities with semi-automated wire bonding and flip-chip technology, enhancing our service offerings. The introduction of CoB standard test photonics assembly module provided a robust platform for PIC testing. VLC expanded to facilities, operating in a 500 m² class 1,000 (ISO-6) clean room at the Polytechnic City of Innovation. This state-of-the-art facility includes advanced tools for flip-chip bonding and photonic alignment tools.
Sophisticated testing process developments for (left) edge-coupling fiber bonding chip-on-board, (middle) Au-bump deposition and flip-chip die-attachment, and (right) reliable dense wire-bonding with glop-top encapsulation.
2022: Enhanced Customization
Recognizing clients’ diverse needs, VLC began offering more customized photonics assembly services. These services included in-house design for ad-hoc electrical low-frequency signal boards, custom PCB designs for RF routing, and advanced 3D modeling for custom holder plates.
(Left) Dedicated RF PCB adapted to VLC photonics assembly standard Chip-on-Board test module. Image before edge fiber bonding. (Right) Improved module protective case for increased robustness with the latest photonics assembly.
2024: Continued Growth and Advanced Capabilities
By 2024, VLC Photonics had grown to over 29 employees, continuing to expand its services and expertise. Offerings now include free-space air gap (no-epoxy) bonding between fibers and the facet of the PIC, a solution that usually is required for spot-size converters based on suspended waveguides, high-power light coupling to avoid the burn of the epoxy, and in bio-functionalized devices to keep the surface clear of contamination. The assembly service includes microscopic visual inspection, custom wire bonding, and flip-chip die-attach bonding developments.
VLC Photonics also provides advanced and volume packaging solutions through partnerships with various packaging experts. We interface with partners offering different services and capabilities to deliver sophisticated prototyping and initial packaging runs, qualification measurement campaigns, or scaling roadmaps. For volume manufacturing, our Hitachi High-Tech partner companies can accelerate the time-to-market for packaging.
Customized prototyping solutions
For applications not compatible with the standard photonics assembly process, VLC Photonics offers customized packaging services, both in-house and through a network of partners. In-house customization includes ad-hoc electrical low-frequency signal board design, custom PCB design for RF routing above 25 GHz, and 3D modeling and design of custom holder plates. Optical mode shaping, coupling efficiency calculations, and light propagation modeling are also part of VLC’s expertise.
Facilities and advanced testing capabilities
VLC Photonics’ facilities include characterization and testing laboratories equipped with tools for microscopic visual inspection, custom wire-bonding, and flip-chip die-attach bonding. The company can handle custom pigtailing routines and offers custom fiber arrays based on specifications. For thermal testing and cycling analysis, VLC has access to a climatic chamber capable of temperatures ranging from -40 to 100°C and humidity ranges from 10% to 90%.
Prospects
VLC Photonics continues to work with many packaging partners to deliver sophisticated prototyping packages and scalable solutions toward pilot production and volume ramp-up. Our adaptable engineering capabilities in photonic assembly and the extensive network for volume services enable everything from R&D projects to commercialization, ensuring tailored solutions for each client’s specific needs.
Celebrating the anniversary, VLC Photonics reflects on its journey from a university spin-off to a leader in the photonics industry, committed to innovation and excellence in PIC prototyping and photonics assembly test solutions
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